SPTS Technologies’ Versalis fxP multi-technology system selected by Mapper Lithography for new Russian plant

NEWPORT, Wales – (COMMERCIAL THREAD) – SPTS Technologies, an Orbotech company and a provider of advanced wafer processing solutions for the global semiconductor industry and related markets, today announced that Mapper Lithography has selected the etching and deposition systems Low Temperature Vapor Phase Chemical (CVD) from SPTS on a Versalis fxP multi-technology platform for their new fab in Moscow. Mapper will use SPTS’s Deep Reactive Ion Etching (DRIE) module to create silicon through-holes with high dimensional accuracy, a critical and essential requirement in the production of electron beam (e-beam) lenses for their technology. revolutionary maskless lithography. Mapper also selected SPTS’s Plasma Enhanced CVD (PECVD) system because it allows a lower deposition temperature than competing systems, allowing for a new integration scheme.

“Mapper’s e-beam lenses are based on high precision holes through silicon wafers,” said Dave Thomas, SPTS Marketing Director for Etching Products. “The Rapier DRIE PM is capable of providing the required high level of profile control, selectivity and uniformity required for these critical characteristics. Additionally, Rapier achieves this at productive burn rates, ensuring the highest yields and lowest possible cost of ownership for Mapper.

“Our maskless lithography tools use innovative multiple electron beam technology with which semiconductors can be manufactured more cost effectively,” said Denis Shamiryan, Director of Manufacturing at Mapper Lithography. “It makes the traditional mask redundant and combines high resolution with high productivity. SPTS’DRIE solutions deliver the etch speed, etch profile and positional accuracy during the silicon etching process that are essential to our approach.

Versalis from SPTS Technologies fxThe P multi-technology cluster platform offers many advantages, including lower cost of ownership and small footprint. By combining DRIE and CVD on the same platform, Mapper has significantly reduced its capital expenditure compared to purchasing single technology systems configured in the traditional way. In addition, Mapper benefits from the single-chamber multi-process capability of SPTS, as the same CVD module can also be used to deposit multiple types of films, including silicon oxide, silicon nitride, and amorphous silicon with exceptional grip and particle performance. With critical temperature sensitive elements of the Mapper product, the ability to deposit high quality films at temperatures

About SPTS Technologies

SPTS Technologies, an Orbotech Company (NASDAQ: ORBK), designs, manufactures, sells and supports thermal etching, PVD, CVD and wafer processing solutions for MEMS, advanced packaging, LED, RF markets high speed over GaA and power management devices. With manufacturing facilities in Newport, Wales, Allentown, Pennsylvania and San Jose, California, the company has operations in 19 countries across Europe, North America and Asia Pacific. For more information on SPTS Technologies, please visit www.spts.com

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